BADERNA, DAVIDE
 Distribuzione geografica
Continente #
NA - Nord America 272
EU - Europa 240
AS - Asia 183
SA - Sud America 12
AF - Africa 1
Totale 708
Nazione #
US - Stati Uniti d'America 268
CN - Cina 116
IE - Irlanda 51
DE - Germania 48
SG - Singapore 37
UA - Ucraina 37
RU - Federazione Russa 26
FI - Finlandia 22
GB - Regno Unito 18
SE - Svezia 18
HK - Hong Kong 14
BR - Brasile 10
IT - Italia 8
FR - Francia 7
IN - India 5
VN - Vietnam 5
AZ - Azerbaigian 2
AT - Austria 1
BD - Bangladesh 1
CA - Canada 1
CL - Cile 1
CO - Colombia 1
CR - Costa Rica 1
DZ - Algeria 1
EE - Estonia 1
ID - Indonesia 1
JM - Giamaica 1
JP - Giappone 1
LT - Lituania 1
MX - Messico 1
PL - Polonia 1
QA - Qatar 1
RO - Romania 1
Totale 708
Città #
Dublin 51
Chandler 46
Jacksonville 37
Ashburn 25
Beijing 23
Nanjing 23
Singapore 23
Hong Kong 14
Nanchang 14
Boardman 13
Shenyang 12
Los Angeles 11
Munich 11
Dallas 9
Lawrence 7
Medford 7
Princeton 7
Changsha 6
Milan 6
Wilmington 6
Ann Arbor 5
Moscow 5
Shanghai 5
Turku 5
Buffalo 4
Frankfurt am Main 4
Hanover 4
Hebei 4
New York 4
Des Moines 3
Hangzhou 3
Hanoi 3
Helsinki 3
Phoenix 3
Tianjin 3
Woodbridge 3
Auburn Hills 2
Brooklyn 2
Jiaxing 2
Kunming 2
Portsmouth 2
Pune 2
Seattle 2
Taizhou 2
Verona 2
Baku 1
Belo Horizonte 1
Bessemer 1
Boston 1
Calgary 1
Chennai 1
Curitiba 1
Doha 1
Fairfield 1
Falkenstein 1
Fortaleza 1
Gothenburg 1
Guangzhou 1
Haiphong 1
Ho Chi Minh City 1
Honolulu 1
Jackson 1
Kingston 1
Kolkata 1
Lauterbourg 1
Manchester 1
Mogi Guaçu 1
Monte Carmelo 1
Myrtle Beach 1
New Delhi 1
Newcastle upon Tyne 1
Poplar 1
Querétaro 1
Redondo Beach 1
Redwood City 1
Reston 1
Richmond 1
Rio de Janeiro 1
San José 1
Santa Clara 1
Santa Luzia 1
Santiago Metropolitan 1
Santiago de Cali 1
St Petersburg 1
Stockholm 1
Tallinn 1
Tokyo 1
Vienna 1
Vitória 1
Votorantim 1
Warsaw 1
Washington 1
Wenzhou 1
Zhengzhou 1
Zhuhai 1
Águas Mornas 1
Totale 481
Nome #
A 1.2 V sense amplifier for high-performance embeddable NOR Flash memories 127
A small-size, fast-settling, low-cost thermal regulator for chip surface measurements 108
A compact low-cost test equipment for thermal and electrical characterization of integrated circuits 108
A versatile and compact USB system for electrical and thermal characterization of non-volatile memories 102
Efficiency comparison between doubler and Dickson charge pumps 96
Thermal regulator for IC temperature characterization using a microprobe station 89
Power efficiency evaluation in Dickson and voltage doubler charge pump topologies 87
Totale 717
Categoria #
all - tutte 2.821
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 2.821


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202131 0 0 0 0 0 7 0 7 1 7 7 2
2021/202235 0 0 0 0 0 3 2 0 0 6 7 17
2022/2023145 15 15 0 12 12 15 0 10 58 2 3 3
2023/202450 3 11 2 3 5 4 8 7 0 3 3 1
2024/2025119 2 8 3 7 5 1 2 8 31 10 13 29
2025/2026110 21 12 16 27 28 6 0 0 0 0 0 0
Totale 717