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EnglishA slow-wave (SW) effect enhancement method based on substrate integrated waveguide (SIW) is presented, theoretically studied, and experimentally validated. The SW effect is achieved by incorporating multi-antipodal metalized blind via-holes and distributed metal strips longitudinally connecting the bottom of upper posts. This improved SIW-based topology achieves a dramatic cutoff frequency reduction of 55.5% with reference to the conventional SIW with the same lateral size. Meanwhile, the phase velocity is reduced remarkably, realizing a more compact longitudinal dimension. The two effects give rise to a planar size reduction of 80% compared to the conventional SIW, which presents a significant advance in SIW miniaturization technology. A prototype is fabricated for a proof-of-concept, and the measured results are in good agreement with simulations, demonstrating its promising application potential and prospect in the microwave and millimeter-wave components.
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| Titolo: | Slow-Wave Effect Enhanced Substrate Integrated Waveguide with Multi-Antipodal Blind Via-Holes and Distributed Metal Strips | |
| Autori: | ||
| Data di pubblicazione: | 2020 | |
| Rivista: | ||
| Abstract: | A slow-wave (SW) effect enhancement method based on substrate integrated waveguide (SIW) is presented, theoretically studied, and experimentally validated. The SW effect is achieved by incorporating multi-antipodal metalized blind via-holes and distributed metal strips longitudinally connecting the bottom of upper posts. This improved SIW-based topology achieves a dramatic cutoff frequency reduction of 55.5% with reference to the conventional SIW with the same lateral size. Meanwhile, the phase velocity is reduced remarkably, realizing a more compact longitudinal dimension. The two effects give rise to a planar size reduction of 80% compared to the conventional SIW, which presents a significant advance in SIW miniaturization technology. A prototype is fabricated for a proof-of-concept, and the measured results are in good agreement with simulations, demonstrating its promising application potential and prospect in the microwave and millimeter-wave components. | |
| Handle: | http://hdl.handle.net/11571/1366375 | |
| Appare nelle tipologie: | 1.1 Articolo in rivista |
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