The hybrid integration of an additively fabricated air-filled waveguide (WG) with a printed circuit board (PCB) is presented. An arrangement is proposed where different waveguiding structures share the same common metal plane on PCB. Such an approach allows combining the low-loss and high- $Q$ properties of an air-filled waveguide, active circuit realization of the strip transmission line, and 3-D capabilities of additive manufacturing. A broadband transition is developed employing a through-patch coupling interface from a microstrip (MS) line to a waveguide. The concept was experimentally validated with exemplary transitions operating within $X$ -band and $K$ -band, featuring a measured bandwidth of $f_{h}/f_{l}~ approx ~1.4$ and average per-transition loss including connecting lines of 1.2 and 1.9 dB, respectively.

Additively Fabricated Air-Filled Waveguide Integrated with Printed Circuit Board Using a Through-Patch Transition

Delmonte N.;Silvestri L.;Marconi S.;Alaimo G.;Auricchio F.;Bozzi M.
2021

Abstract

The hybrid integration of an additively fabricated air-filled waveguide (WG) with a printed circuit board (PCB) is presented. An arrangement is proposed where different waveguiding structures share the same common metal plane on PCB. Such an approach allows combining the low-loss and high- $Q$ properties of an air-filled waveguide, active circuit realization of the strip transmission line, and 3-D capabilities of additive manufacturing. A broadband transition is developed employing a through-patch coupling interface from a microstrip (MS) line to a waveguide. The concept was experimentally validated with exemplary transitions operating within $X$ -band and $K$ -band, featuring a measured bandwidth of $f_{h}/f_{l}~ approx ~1.4$ and average per-transition loss including connecting lines of 1.2 and 1.9 dB, respectively.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11571/1450225
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