The static heat-flow problem has been solved analytically in three dimensions for a two-blocks structure. The computer program calculating the temperature maps is simple and fast. Examples are given of temperature profiles on the chip surface of a high-power IC.
Integrated-circuit thermal modeling
CASTELLO, RINALDO;
1978-01-01
Abstract
The static heat-flow problem has been solved analytically in three dimensions for a two-blocks structure. The computer program calculating the temperature maps is simple and fast. Examples are given of temperature profiles on the chip surface of a high-power IC.File in questo prodotto:
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