RATTI, LODOVICO
 Distribuzione geografica
Continente #
NA - Nord America 10.238
AS - Asia 6.591
EU - Europa 5.570
SA - Sud America 808
AF - Africa 89
Continente sconosciuto - Info sul continente non disponibili 9
OC - Oceania 7
Totale 23.312
Nazione #
US - Stati Uniti d'America 10.069
CN - Cina 3.900
SG - Singapore 1.472
IE - Irlanda 1.323
UA - Ucraina 834
DE - Germania 680
BR - Brasile 668
HK - Hong Kong 639
FI - Finlandia 632
RU - Federazione Russa 598
SE - Svezia 466
IT - Italia 418
GB - Regno Unito 289
VN - Vietnam 205
FR - Francia 101
CA - Canada 92
IN - India 88
AT - Austria 52
AR - Argentina 47
BD - Bangladesh 46
MX - Messico 45
IQ - Iraq 40
BE - Belgio 35
PL - Polonia 32
ZA - Sudafrica 31
JP - Giappone 28
EC - Ecuador 26
NL - Olanda 21
PK - Pakistan 21
ES - Italia 20
TR - Turchia 20
MA - Marocco 18
SA - Arabia Saudita 16
CO - Colombia 15
PY - Paraguay 14
VE - Venezuela 13
CZ - Repubblica Ceca 12
LT - Lituania 12
ID - Indonesia 11
MU - Mauritius 11
IR - Iran 10
JO - Giordania 10
AL - Albania 9
CL - Cile 9
PE - Perù 9
DO - Repubblica Dominicana 8
KZ - Kazakistan 8
UZ - Uzbekistan 8
AE - Emirati Arabi Uniti 7
CR - Costa Rica 7
IL - Israele 7
NP - Nepal 7
CH - Svizzera 6
DZ - Algeria 6
EU - Europa 6
GR - Grecia 6
PH - Filippine 6
AZ - Azerbaigian 5
EG - Egitto 5
MY - Malesia 5
OM - Oman 5
BG - Bulgaria 4
KE - Kenya 4
LB - Libano 4
RO - Romania 4
BA - Bosnia-Erzegovina 3
BO - Bolivia 3
HU - Ungheria 3
JM - Giamaica 3
KH - Cambogia 3
KW - Kuwait 3
LV - Lettonia 3
NZ - Nuova Zelanda 3
TT - Trinidad e Tobago 3
AU - Australia 2
BN - Brunei Darussalam 2
BS - Bahamas 2
DM - Dominica 2
ET - Etiopia 2
GM - Gambi 2
GY - Guiana 2
HN - Honduras 2
KG - Kirghizistan 2
KR - Corea 2
MK - Macedonia 2
PS - Palestinian Territory 2
SK - Slovacchia (Repubblica Slovacca) 2
SN - Senegal 2
TN - Tunisia 2
TW - Taiwan 2
UY - Uruguay 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AM - Armenia 1
BH - Bahrain 1
BW - Botswana 1
BY - Bielorussia 1
CU - Cuba 1
CW - ???statistics.table.value.countryCode.CW??? 1
EE - Estonia 1
GA - Gabon 1
Totale 23.295
Città #
Dallas 2.786
Dublin 1.323
Chandler 1.297
Jacksonville 1.050
Nanjing 942
Singapore 644
Hong Kong 632
Ashburn 544
Beijing 489
Boardman 454
Nanchang 369
Princeton 293
Lawrence 285
Medford 277
Wilmington 272
Shenyang 269
Changsha 247
Hebei 245
Jiaxing 212
Los Angeles 211
Hangzhou 175
Tianjin 156
Helsinki 148
Buffalo 144
Ann Arbor 142
Pavia 123
Moscow 105
Redondo Beach 101
Shanghai 87
Milan 84
New York 81
Munich 74
Ho Chi Minh City 71
Woodbridge 65
São Paulo 62
Hanoi 54
Nuremberg 45
Norwalk 40
Verona 40
Des Moines 37
Toronto 37
Seattle 35
Brussels 32
Chicago 32
Guangzhou 32
Turku 31
Houston 30
Mcallen 30
Warsaw 30
Jinan 29
Santa Clara 28
Tokyo 26
Stockholm 25
Zhengzhou 25
Boston 24
Ningbo 24
Vienna 24
Fairfield 22
Brooklyn 20
Chennai 20
Baghdad 18
Falkenstein 18
Frankfurt am Main 18
Phoenix 18
Rio de Janeiro 18
San Jose 18
Duncan 17
Monsummano Terme 17
Mexico City 16
Johannesburg 15
London 15
Montreal 15
San Francisco 15
Secaucus 15
The Dalles 15
Atlanta 14
Auburn Hills 14
Porto Alegre 14
Washington 14
Kunming 13
Denver 12
Fuzhou 12
Montréal 12
Curitiba 11
Lauterbourg 11
Ankara 10
Changchun 10
Charlotte 10
Haiphong 10
Hyderabad 10
Lanzhou 10
Manchester 10
Orem 10
Poplar 10
Taizhou 10
Amman 9
Augusta 9
Dalmine 9
Nürnberg 9
Portsmouth 9
Totale 15.751
Nome #
0.13 um CMOS technologies for radiation hardness analog front-end circuits in LHC upgrades 2.535
Impact of low-dose electron irradiation on n+p silicon strip sensors 190
A 2D Imager for X-Ray FELs with a 65 nm CMOS Readout Based on per-Pixel Signal Compression and 10 Bit A/D Conversion 184
PixFEL: Developing a Fine Pitch, Fast 2D X-Ray Imager for the Next Generation X-FELs 133
A 10 bit resolution readout channel with dynamic range compression for X-ray imaging at FELs 126
Characterization of a large scale DNW MAPS fabricated in a 3D integration process 124
Advances in the development of pixel detector for the SuperB Silicon Vertex Tracker 120
Active pixel sensors with enhanced pixel-level analog and digital functionalities in a 2-tier 3D CMOS technology 116
A 3D Vertically Integrated Deep N-Well CMOS MAPS for the SuperB Layer0 113
A Pixelated X-Ray Detector for Diffraction Imaging at Next-Generation High-Rate FEL Sources 111
2D and 3D CMOS MAPS with high performance pixel-level signal processing 109
The PixFEL Project: Development of Advanced X-Ray Pixel Detectors for Application at Future FEL Facilities 109
Alignment of the CMS tracker with LHC and cosmic ray data 109
130 and 90 nm CMOS technologies for detector front-end applications 108
2D and 3D thin pixel technologies for the Layer0 of the SuperB Silicon Vertex Tracker 108
Dynamic Compression of the Signal in a Charge Sensitive Amplifier: From Concept to Design 106
CMOS technologies in the 100 nm range for rad-hard front-end electronics in future collider experiments. 105
A 65-nm CMOS prototype chip with monolithic pixel sensors and fast front-end electronics 104
Monolithic Pixel Sensors for Fast Silicon Vertex Trackers in a Quadruple Well CMOS Technology 104
A 4096-pixel MAPS device with on-chip data sparsification 103
The BABAR Detector 102
Design and characterization of integrated front-end transistors in a microstrip detector technology 102
A 3D deep n-well CMOS MAPS for the ILC vertex detector 100
CMOS MAPS with pixel level sparsification and time stamping capabilities for applications at the ILC 97
A Time Interleaved, 10-Bit SAR ADC with Split Capacitor DAC for Diffraction Imaging at X-Ray FELs 96
Beam-test results of 4k pixel CMOS MAPS and high resistivity striplet detectors equipped with digital sparsied readout in the Slim5 low mass silicon demonstrator 95
An ionization chamber shower detector for the LHC luminosity monitor 95
In-Pixel Conversion with a 10 Bit SAR ADC for Next Generation X-Ray FELs 95
Radiation effects on the noise parameters of a 0.18um CMOS technology for detector front-end applications 95
Bulk damage in proton irradiated JFET transistors and charge preamplifiers on high resistivity silicon 94
PFM2: a 32×32 Processor for X-Ray Diffraction Imaging at FELs 93
A novel monolithic active pixel detector in 0.13 μm triple well CMOS technology with pixel level analog processing 92
The BaBar Silicon Vertex Tracker: Performance, running experience and radiation damage studies 92
Modeling Charge Loss in CMOS MAPS Exposed to Non-Ionizing Radiation 91
65-nm CMOS Front-End Channel for Pixel Readout in the HL-LHC Radiation Environment 91
Deep n-well MAPS in a 130 nm CMOS technology: Beam test results 90
Analog design criteria for high-granularity detector readout in the 65 nm CMOS technology 90
Discriminators in 65 nm CMOS process for high granularity, high time resolution pixel detectors 90
An ionization chamber shower detector for the LHC luminosity monitor 90
The PixFEL Front-End for X-Ray Imaging in the Radiation Environment of Next Generation FELs 90
Effects induced by gamma-radiation on P and N-channel junction field effect transistors 89
The analog signal processing system for the Auger fluorescence detector prototype 89
Low-noise fast charge sensitive amplifier with dynamic signal compression 89
CMOS MAPS with fully integrated, hybrid-pixel-like analog front-end electronics 88
Low-noise design criteria for detector readout systems in deep submicron CMOS technology 88
Impact of Lateral Isolation Oxides on Radiation-Induced Noise Degradation in CMOS Technologies in the 100-nm Regime 87
A fabrication process for silicon microstrip detectors with integrated front-end electronics 87
Noise performance of 0.13 μm CMOS technologies for detector front-end applications 86
Noise Behavior of a 180 nm CMOS SOI Technology for Detector Front-End Electronics 86
The analog signal processing system for the Auger fluorescence detector prototype 86
A 65nm CMOS analog processor with zero dead time for future pixel detectors 86
Design and Performance of a DNW CMOS Active Pixel Sensor for the ILC Vertex Detector 86
Noise limits of AToM, a 128 channel CMOS readout chip in applications with room temperature high granularity detectors 85
A new approach to the design of monolithic active pixel detectors in 0.13 um triple well CMOS technology 85
Proton induced damage in JFET transistors and charge preamplifiers on high-resistivity silicon 85
DCR Performance in Neutron-Irradiated CMOS SPADs from 150- To 180-nm Technologies 85
Front-end electronics for energy and position measurements with semiconductor radiation detectors 84
Performance of the BABAR silicon vertex tracker 84
The analog signal processor of the auger fluorescence detector prototype 84
Deep submicron CMOS transistors for low-noise front-end systems 84
Monolithic pixel sensors for fast particle trackers in a quadruple well CMOS technology 84
Fabrication of Microstrip Detectors and Integrated Electronics on High Resistivity Silicon 84
Novel active signal compression in low-noise analog readout at future X-ray FEL facilities 84
Description and performance of track and primary-vertex reconstruction with the CMS tracker 84
Evaluation of the radiation tolerance of 65 nm CMOS devices for high-density front-end electronics 84
APiX: a Geiger-mode Avalanche Digital Sensor for Particle Detection 84
Instrumentation for noise measurements on CMOS transistors for fast detector preamplifiers 83
Response of SOI bipolar transistors exposed to gamma-rays under different dose rate and bias conditions 83
Development of a detector for bunch by bunch measurements and optimization of luminosity in the LHC 83
Low noise junction field effect transistors in a silicon radiation detector technology 82
Radiation tolerance of a 0.18 um CMOS process 82
A study for the detection of ionizing particles with phototransistors on thick high-resistivity silicon substrates 82
The Apsel65 front-end chip for the readout of pixel sensors in the 65 nm CMOS node 82
APiX, a two-tier avalanche pixel sensor for digital charged particle detection 82
Lessons learned from babar silicon vertex tracker, limits and future perspectives of the detector 81
3D DNW MAPS for high resolution, highly efficient, sparse readout CMOS detectors 81
The PixFEL Project: Progress towards a Fine Pitch X-Ray Imaging Camera for Next Generation FEL Facilities 81
Design and TCAD Simulation of Planar p-on-n Active-Edge Pixel Sensors for the Next Generation of FELs 81
First Experimental Results on Active and Slim-Edge Silicon Sensors for XFEL 81
Noise characterization of 130 nm and 90 nm CMOS technologies for analog front-end electronics 80
Noise degradation induced by γ-rays on P- and N-channel junction field-effect transistors 80
Continuous Time-Charge Amplification and Shaping in CMOS Monolithic Sensors for Particle Tracking 80
The superB silicon vertex tracker 80
Analog front-end for pixel sensors in a 3D CMOS technology for the SuperB Layer0 80
Integrated front-end electronics in a detector compatible process: source-follower and charge-sensitive preamplifier configuration 80
Low-Noise Readout Channel with a Novel Dynamic Signal Compression for Future X-FEL Applications 80
Geiger-mode avalanche pixels in 180 nm HV CMOS process for a dual-layer particle detector 80
Recent development on triple well 130 nm CMOS MAPS with in-pixel signal processing and data sparsification capability 79
Performance of the BaBar silicon vertex tracker 79
The high rate data acquisition system for the SLIM5 beam test 79
Design and TCAD Simulations of Planar Active-Edge Pixel Sensors for Future XFEL Applications 79
CHIPIX65: Developments on a new generation pixel readout ASIC in CMOS 65 nm for HEP experiments 79
Radiation hardness study of proton irradiated SOI bipolar transistors 78
Monolithic sensors in deep submicron CMOS technology for low material budget, high rate HEP applications 78
Radiation hardness and monitoring of the BaBar vertex tracker 78
The first fully functional 3D CMOS chip with Deep N-well active pixel sensors for the ILC vertex detector 78
The associative memory for the self-triggered SLIM5 silicon telescope 77
Monolithic pixel detectors in a 0.13 um CMOS technology with sensor level continuous time charge amplification and shaping 77
Beam test results of different configurations of deep N-well MAPS matrices featuring in pixel full signal processing 77
PFM2: A 32×32 Readout Chip for the PixFEL X-Ray Imager Demonstrator 77
Totale 11.643
Categoria #
all - tutte 104.129
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 104.129


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/20211.093 0 0 0 0 0 208 14 260 86 268 196 61
2021/20221.294 9 5 46 24 43 43 41 71 82 63 176 691
2022/20233.754 434 219 30 281 408 415 5 226 1.573 16 98 49
2023/20241.330 112 301 55 79 148 272 27 102 17 48 110 59
2024/20253.385 63 343 77 197 70 28 152 281 855 127 328 864
2025/20266.655 621 1.257 2.464 933 1.033 347 0 0 0 0 0 0
Totale 23.880