IRIS
RATTI, LODOVICO
 Distribuzione geografica
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Continente #
NA - Nord America 5.665
EU - Europa 4.406
AS - Asia 3.033
AF - Africa 14
Continente sconosciuto - Info sul continente non disponibili 7
OC - Oceania 5
SA - Sud America 2
Totale 13.132
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Nazione #
US - Stati Uniti d'America 5.621
CN - Cina 2.990
IE - Irlanda 1.320
UA - Ucraina 824
FI - Finlandia 586
DE - Germania 531
SE - Svezia 440
IT - Italia 348
GB - Regno Unito 216
FR - Francia 70
CA - Canada 44
BE - Belgio 30
RU - Federazione Russa 21
IN - India 18
MU - Mauritius 11
NL - Olanda 7
EU - Europa 6
GR - Grecia 4
HK - Hong Kong 4
IR - Iran 4
PK - Pakistan 4
MY - Malesia 3
NZ - Nuova Zelanda 3
AR - Argentina 2
AU - Australia 2
BD - Bangladesh 2
CH - Svizzera 2
DZ - Algeria 2
JP - Giappone 2
PL - Polonia 2
TR - Turchia 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AL - Albania 1
BA - Bosnia-Erzegovina 1
CZ - Repubblica Ceca 1
ES - Italia 1
ID - Indonesia 1
KH - Cambogia 1
LV - Lettonia 1
SG - Singapore 1
VN - Vietnam 1
ZA - Sudafrica 1
Totale 13.132
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Città #
Dublin 1.320
Chandler 1.297
Jacksonville 1.049
Nanjing 937
Ashburn 370
Nanchang 369
Princeton 293
Lawrence 285
Medford 277
Wilmington 272
Shenyang 265
Hebei 245
Changsha 230
Jiaxing 211
Beijing 190
Hangzhou 169
Tianjin 153
Ann Arbor 142
Boardman 142
Helsinki 136
Pavia 112
Milan 76
Woodbridge 64
Norwalk 40
Verona 40
New York 38
Shanghai 37
Des Moines 36
Munich 32
Mcallen 30
Seattle 29
Brussels 28
Toronto 25
Fairfield 22
Houston 22
Ningbo 22
Jinan 20
Zhengzhou 18
Duncan 17
Monsummano Terme 17
Guangzhou 16
Auburn Hills 14
Washington 13
Kunming 12
Montréal 12
Los Angeles 11
Fuzhou 10
Augusta 9
Dalmine 9
Nürnberg 9
Taizhou 9
West Jordan 8
Leawood 7
Orange 7
Pune 7
Borås 6
Changchun 6
Cormano 6
Lanzhou 6
Meda 6
Bergamo 5
London 5
Bengaluru 4
Buffalo 4
Mascalucia 4
Redmond 4
Bayreuth 3
Bologna 3
Como 3
Dearborn 3
Haikou 3
Hamburg 3
Hanover 3
Monza 3
Mountain View 3
Phoenix 3
San Mateo 3
Somma Lombardo 3
Trieste 3
Andover 2
Ardabil 2
Bangalore 2
Cedar Knolls 2
Chicago 2
Cornaredo 2
Dallas 2
Falkenstein 2
Groningen 2
Hasselt 2
Kemerovo 2
Kuala Lumpur 2
Las Vegas 2
Morteros 2
Moscow 2
Qingdao 2
Redwood City 2
Rockville 2
Saint Petersburg 2
Secaucus 2
Shaoxing 2
Totale 9.367
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Nome #
Impact of low-dose electron irradiation on n+p silicon strip sensors 164
0.13 um CMOS technologies for radiation hardness analog front-end circuits in LHC upgrades 158
A 2D Imager for X-Ray FELs with a 65 nm CMOS Readout Based on per-Pixel Signal Compression and 10 Bit A/D Conversion 138
Active pixel sensors with enhanced pixel-level analog and digital functionalities in a 2-tier 3D CMOS technology 89
Characterization of a large scale DNW MAPS fabricated in a 3D integration process 89
PixFEL: Developing a Fine Pitch, Fast 2D X-Ray Imager for the Next Generation X-FELs 84
A 10 bit resolution readout channel with dynamic range compression for X-ray imaging at FELs 79
Design and characterization of integrated front-end transistors in a microstrip detector technology 77
Monolithic Pixel Sensors for Fast Silicon Vertex Trackers in a Quadruple Well CMOS Technology 75
Advances in the development of pixel detector for the SuperB Silicon Vertex Tracker 75
Radiation effects on the noise parameters of a 0.18um CMOS technology for detector front-end applications 75
Effects induced by gamma-radiation on P and N-channel junction field effect transistors 74
The PixFEL Project: Development of Advanced X-Ray Pixel Detectors for Application at Future FEL Facilities 74
The BABAR Detector 72
CMOS MAPS with pixel level sparsification and time stamping capabilities for applications at the ILC 72
130 and 90 nm CMOS technologies for detector front-end applications 70
Noise performance of 0.13 μm CMOS technologies for detector front-end applications 70
A 3D Vertically Integrated Deep N-Well CMOS MAPS for the SuperB Layer0 70
2D and 3D CMOS MAPS with high performance pixel-level signal processing 69
Noise limits of AToM, a 128 channel CMOS readout chip in applications with room temperature high granularity detectors 68
The analog signal processor of the auger fluorescence detector prototype 68
Deep submicron CMOS transistors for low-noise front-end systems 68
CMOS technologies in the 100 nm range for rad-hard front-end electronics in future collider experiments. 67
A 65-nm CMOS prototype chip with monolithic pixel sensors and fast front-end electronics 67
Front-end electronics for energy and position measurements with semiconductor radiation detectors 66
Impact of Lateral Isolation Oxides on Radiation-Induced Noise Degradation in CMOS Technologies in the 100-nm Regime 66
Discriminators in 65 nm CMOS process for high granularity, high time resolution pixel detectors 66
The analog signal processing system for the Auger fluorescence detector prototype 66
Continuous Time-Charge Amplification and Shaping in CMOS Monolithic Sensors for Particle Tracking 65
Proton induced damage in JFET transistors and charge preamplifiers on high-resistivity silicon 65
Noise Behavior of a 180 nm CMOS SOI Technology for Detector Front-End Electronics 65
The analog signal processing system for the Auger fluorescence detector prototype 65
A 4096-pixel MAPS device with on-chip data sparsification 65
The BaBar Silicon Vertex Tracker: Performance, running experience and radiation damage studies 64
The Apsel65 front-end chip for the readout of pixel sensors in the 65 nm CMOS node 64
Analog design criteria for high-granularity detector readout in the 65 nm CMOS technology 64
Low-noise design criteria for detector readout systems in deep submicron CMOS technology 64
Performance of the BABAR silicon vertex tracker 63
Noise characterization of 130 nm and 90 nm CMOS technologies for analog front-end electronics 63
Lessons learned from babar silicon vertex tracker, limits and future perspectives of the detector 63
In-Pixel Conversion with a 10 Bit SAR ADC for Next Generation X-Ray FELs 63
Response of SOI bipolar transistors exposed to gamma-rays under different dose rate and bias conditions 63
Radiation tolerance of a 0.18 um CMOS process 62
A 3D deep n-well CMOS MAPS for the ILC vertex detector 62
Evaluation of the radiation tolerance of 65 nm CMOS devices for high-density front-end electronics 62
Total Ionizing Dose effects in 130-nm commercial CMOS technologies for HEP experiments 61
A novel monolithic active pixel detector in 0.13 μm triple well CMOS technology with pixel level analog processing 61
2D and 3D thin pixel technologies for the Layer0 of the SuperB Silicon Vertex Tracker 61
Analog front-end for pixel sensors in a 3D CMOS technology for the SuperB Layer0 61
Integrated front-end electronics in a detector compatible process: source-follower and charge-sensitive preamplifier configuration 61
Development of a detector for bunch by bunch measurements and optimization of luminosity in the LHC 61
Bulk damage in proton irradiated JFET transistors and charge preamplifiers on high resistivity silicon 60
CMOS MAPS with fully integrated, hybrid-pixel-like analog front-end electronics 60
Radiation hardness and monitoring of the BaBar vertex tracker 60
First results from the characterization of a three-dimensional deep N-well MAPS prototype for vertexing applications 60
Fabrication of Microstrip Detectors and Integrated Electronics on High Resistivity Silicon 60
The high rate data acquisition system for the SLIM5 beam test 60
An ionization chamber shower detector for the LHC luminosity monitor 60
Modeling Charge Loss in CMOS MAPS Exposed to Non-Ionizing Radiation 60
A Pixelated X-Ray Detector for Diffraction Imaging at Next-Generation High-Rate FEL Sources 60
65-nm CMOS Front-End Channel for Pixel Readout in the HL-LHC Radiation Environment 60
PFM2: a 32×32 Processor for X-Ray Diffraction Imaging at FELs 60
Noise performances of 0.13 um CMOS technologies for detector front-end applications 59
Monolithic sensors in deep submicron CMOS technology for low material budget, high rate HEP applications 59
First generation of deep n-well CMOS MAPS with in-pixel sparsication for the ILC vertex detector 59
Vertically integrated deep N-well CMOS MAPS with sparsification and time stamping capabilities for thin charged particle trackers 59
Design and Performance of a DNW CMOS Active Pixel Sensor for the ILC Vertex Detector 59
Noise degradation induced by γ-rays on P- and N-channel junction field-effect transistors 58
Instrumentation for gate current noise measurements on sub-100 nm MOS transistors 58
The associative memory for the self-triggered SLIM5 silicon telescope 58
Monolithic pixel detectors in a 0.13 um CMOS technology with sensor level continuous time charge amplification and shaping 58
The superB silicon vertex tracker 58
Deep n-well MAPS in a 130 nm CMOS technology: Beam test results 58
Low noise junction field effect transistors in a silicon radiation detector technology 57
Instrumentation for noise measurements on CMOS transistors for fast detector preamplifiers 57
JFET preamplifiers with different reset techniques on detector-grade high-resistivity silicon 57
Optimum Design of DACs for Threshold Correction in Multichannel Processors for Radiation Detectors 57
Performance of the BaBar silicon vertex tracker 57
Assessment of a Low-Power 65 nm CMOS Technology for Analog Front-End Design 57
Effects of substrate thinning on the properties of quadruple well CMOS MAPS 57
Radiation hardness study of proton irradiated SOI bipolar transistors 56
MAPS in 130 nm triple well CMOS technology for HEP applications 56
Radiation damage studies of detector-compatible Si JFETs 56
Beam-test results of 4k pixel CMOS MAPS and high resistivity striplet detectors equipped with digital sparsied readout in the Slim5 low mass silicon demonstrator 56
Front-end electronics in a 65 nm CMOS process for high density readout of pixel sensors 56
Radiation hardness characterization of the front-end chip for the BaBar silicon vertex tracker 56
An improved fabrication process for Si-detector-compatible JFETs 56
TID Effects in Deep N-Well CMOS Monolithic Active Pixel Sensors 56
A study for the detection of ionizing particles with phototransistors on thick high-resistivity silicon substrates 55
Recent development on triple well 130 nm CMOS MAPS with in-pixel signal processing and data sparsification capability 55
Vertex detector for the SuperB Factory 55
The first fully functional 3D CMOS chip with Deep N-well active pixel sensors for the ILC vertex detector 55
The PixFEL Project: Progress towards a Fine Pitch X-Ray Imaging Camera for Next Generation FEL Facilities 55
Alignment of the CMS tracker with LHC and cosmic ray data 55
DCR Performance in Neutron-Irradiated CMOS SPADs from 150- To 180-nm Technologies 55
Impact of gate-leakage current noise in sub-100 nm CMOS front-end electronics 54
Initial test results of an ionization chamber shower detector for a LHC luminosity monitor 54
A new approach to the design of monolithic active pixel detectors in 0.13 um triple well CMOS technology 54
BaBar silicon vertex tracker: status and prospects 54
Properties and performance of the prototype instrument for the Pierre Auger Observatory 54
Totale 6.529
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Categoria #
all - tutte 47.229
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 47.229
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/201972 0 0 0 0 0 0 0 0 0 8 4 60
2019/20203.560 1.044 1.592 7 157 9 156 15 169 4 190 166 51
2020/20211.684 202 131 61 186 11 208 14 260 86 268 196 61
2021/20221.294 9 5 46 24 43 43 41 71 82 63 176 691
2022/20233.754 434 219 30 281 408 415 5 226 1.573 16 98 49
2023/20241.139 112 301 55 79 148 272 27 102 17 26 0 0
Totale 13.649